|
DIP Series - For 2.4G/ 5.5G
Applications |
 |
Chilisin offer multilayer devices
of Low-Temperature Cofired Ceramics (LTCC) for applications
in wireless communication as WLAN, Bluetooth etc. Our
commitment is to meet your goals through extensive technological
innovation, excellent quality, short lead time and high
volume production capability. |
| Feature |
กด
Minaturized 2.0 * 1.25 * 0.6 mm
กด Low insertion loss
กด High
rejection at lower stop band and 2nd harmonic band |
| Applications |
|
กด
2.4GHz ISM band WLAN and Bluetooth
|
| Product
Identification |
|
กด
Series Dimension and Impedance: 2012= 2.0mm*1.25mm
, Impedance:50ฃ[
กด Packing :T=Taping
, B=Bulk
กด Central Frequency: 2450=2.45GHz |
| Shapes
and Dimensions |
|
DIP2012T2455HA1
|
DIP2012T2455HA2 
|
Unit: mm |
TYPE |
L |
W |
T |
a |
b |
c |
g |
p |
DIP2012T2455HA1 |
2.0กำ0.1 |
1.25กำ0.1 |
0.7กำ0.1 |
0.3กำ0.1 |
0.2กำ0.1 |
0.3กำ0.15 |
0.35กำ0.1 |
0.65กำ0.1 |
DIP2012T2455HA2 |
2.0กำ0.1 |
1.25กำ0.1 |
0.7กำ0.1 |
0.3กำ0.1 |
0.2กำ0.1 |
0.3กำ0.15 |
0.35กำ0.1 |
0.65กำ0.1 |
|
| Recommended
Pattern |
DIP2012T2455HA1
|
DIP2012T2455HA2
|
| |
TYPE |
D1 |
D2 |
D3 |
D4 |
DIP2012T2455HA1 |
0.35กำ0.1 |
0.35กำ0.1 |
0.8กำ0.1 |
0.65กำ0.1 |
DIP2012T2455HA2 |
0.35กำ0.1 |
0.75กำ0.1 |
0.35กำ0.1 |
0.65กำ0.1 |
|
| Specifications
of DIP series |
| |
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| DIP |
 |
Reliability |
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All
specifications are subject to change without notice. |
